Yes, absolutely! We are committed to offering quick turnaround times. Although it would be depending on your requirement, complexity of products and quantity as well. For any kind of urgent assistance or queries, feel free to contact us.

Yes, all you need to do is share your exact BGA assembly requirements at Request Quote Form, and we will review it and get back to you with custom quotes!

Yes, of course. We conduct a careful DFM check to develop an optimized thermal profile.

For BGA Printed Circuit Board assembly, we have stringent testing protocols including: X-ray inspection Functional Testing Automated Optical Inspection

We cater to BGA Printed Circuit Board Assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.

Yes absolutely! You can count on us for BGA rework services that ensure optimal performance.

High density, better electrical conductivity, lower thermal resistance, easy to assembly & manage are some of the advantages of BGA PCB.

Our BGA Printed Circuit Board capabilities span the following: Micro Ball Grid Array (µBGA) Thin Chip Array Ball Grid Array (CTBGA) Chip Array Ball Grid Array (CABGA) Very Thin Chip Array Ball Grid Array (CVBGA) Very Fine Pitch Ball Grid Array (VFBGA) Land Grid Array (LGA) Chip scale Package (CSP) Wafer level chip scale packaging (WLCSP)

Some of the factors that impact the quality of BGA assembly include checking for the laminate material compatibility, the warpage requirement, surface finish effect, solder mask clearance and more.

BGA or Ball Grid Array is a high-density PCB packaging technology that is used extensively for Integrated Circuits. With the precision component placement that it offers, it is a popular Surface Mount packaging.