BGA ASSEMBLY FAQ
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1. What exactly is BGA Assembly?BGA or Ball Grid Array is a high-density PCB packaging technology that is used extensively for Integrated Circuits. With the precis...Learn MoreBGA or Ball Grid Array is a high-density PCB packaging technology that is used extensively for Integrated Circuits. With the precision component placement that it offers, it is a popular Surface Mount packaging.
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2. What are some of the factors that affect the quality of BGA Assembly?Some of the factors that impact the quality of BGA assembly include checking for the laminate material compatibility, the warpage r...Learn MoreSome of the factors that impact the quality of BGA assembly include checking for the laminate material compatibility, the warpage requirement, surface finish effect, solder mask clearance and more.
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3. What are the capabilities of BGA Printed Circuit Board?Our BGA Printed Circuit Board capabilities span the following: Micro Ball Grid Array (BGA) Thin Chip Array Ball Grid Array (CTBGA) ...Learn MoreOur BGA Printed Circuit Board capabilities span the following:Micro Ball Grid Array (µBGA)Thin Chip Array Ball Grid Array (CTBGA)Chip Array Ball Grid Array (CABGA)Very Thin Chip Array Ball Grid Array (CVBGA)Very Fine Pitch Ball Grid Array (VFBGA)Land Grid Array (LGA)Chip scale Package (CSP)Wafer level chip scale packaging (WLCSP)
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4. What are the advantages of BGA board assembly?High density, better electrical conductivity, lower thermal resistance, easy to assembly manage are some of the advantages of BGA P...Learn MoreHigh density, better electrical conductivity, lower thermal resistance, easy to assembly & manage are some of the advantages of BGA PCB.
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5. Do you also undertake BGA rework?Yes absolutely! You can count on us for BGA rework services that ensure optimal performance....Learn MoreYes absolutely! You can count on us for BGA rework services that ensure optimal performance.
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6. What kind of sizes do you cater for BGA Printed Circuit Board?We cater to BGA Printed Circuit Board Assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm....Learn MoreWe cater to BGA Printed Circuit Board Assemblies in sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.
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7. What kind of testing do you do for BGA Printed Circuit Board assembly?For BGA Printed Circuit Board assembly, we have stringent testing protocols including: X-ray inspection Functional Testing Automate...Learn MoreFor BGA Printed Circuit Board assembly, we have stringent testing protocols including:X-ray inspectionFunctional TestingAutomated Optical Inspection
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8. Do you conduct a design for manufacturability test for Ball Grid Array Assembly?Yes, of course. We conduct a careful DFM check to develop an optimized thermal profile....Learn MoreYes, of course. We conduct a careful DFM check to develop an optimized thermal profile.
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9. Do you offer custom quote for BGA Printed Circuit Board?Yes, all you need to do is share your exact BGA assembly requirements at Request Quote Form, and we will review it and get back to ...Learn MoreYes, all you need to do is share your exact BGA assembly requirements at Request Quote Form, and we will review it and get back to you with custom quotes!
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10.Can you offer BGA assemblies in quick turnaround time?Yes, absolutely! We are committed to offering quick turnaround times. Although it would be depending on your requirement, complexit...Learn MoreYes, absolutely! We are committed to offering quick turnaround times. Although it would be depending on your requirement, complexity of products and quantity as well. For any kind of urgent assistance or queries, feel free to contact us.