Solder beads and pinholes are common process defects duringSMT printingand reflow process. They not only affect board ap···

Tombstoning is a typical common defect for chip components. One end of the component lifts away from the pad while only ···

Nowadays, electronic products are developing towards thinner, smaller and smarter design, driving the entire SMT industr···

With the continuous upgrading of global environmental protection regulations, lead-free soldering has become the mainstr···

Reflow soldering is one of the most critical procedures in SMT production, and it directly determines the solder joint q···

In the electronic engineering industry, PCB and PCBA are two basic and common concepts, yet most people cannot clearly d···

In the SMT production process, various soldering defects often occur during reflow welding. These problems will affect t···

Dry Goods Sharing | Globalwell Explains 17 Common Soldering Defects & Judgment Standards in SMT Reflow SolderingAfte···

Globalwei Optimizes Micro Component Placement Process to Meet 01005 Component Processing RequirementsAs electronic devic···