If you are looking at mounting high performance devices, Ball Grid Array (BGA) assembly as it is popularly called, is your answer. A high-density PCB packaging technology, it is extensively used for Integrated Circuits (ICs). On account of its ability to offer high-density packaging with precision component placement, BGA is a popular Surface Mount Packaging that finds use in several electronic components where miniaturization is the order of the day.
At GLOBAL WELL TECH, our extensive experience in BGA Assembly services is what has led to clients relying on us for their intricate designs. Irrespective of your size requirements, you can rest assured that we will be able to cater to your bespoke needs. Our robust testing methodologies ensure accuracy of the Ball Grid Array (BGA) Assembly. In addition, you can also count on us for extensive BGA Assembly rework.
Our unstinting devotion to quality and customer satisfaction means that once you partner with us, you can rest assured that you will get nothing but the best. The customer-oriented approach also shows up in your commitment to delivery times. With quick turnaround times, you can reap the benefit of quick time-to-market, which, in turn, can be a major source of competitive advantage.
Whether your requirement is BGA PCB design, BGA PCB, BGA PCB layout, BGA Assembly or BGA rework, you can rest assured that you will get superior quality and performance, that will in turn, positively impact the performance of your final product.
With our efficient network of component suppliers and the many economies of scale that we enjoy, that you will get optimal costs, is a given.
Contact us with your bespoke BGA PCB requirements and we will be able to offer you quick custom quotes.