1. Standard Stencil Management

1. Storage & Registration

   Inspect new stencils on appearance, aperture and tension before use. Store idle stencils vertically on special racks to avoid deformation, and mark them with serial numbers for easy management.

2. Cleaning Maintenance

   Thoroughly clean stencils after each batch or product change to remove residual solder paste and flux. Clean blocked apertures in time during production.

3. Regular Inspection

   Check stencil tension, aperture size and surface condition regularly. Replace damaged or deformed stencils immediately.

4. Custom Selection

   Match stencil thickness and aperture design according to component packages. Optimize aperture for tiny components and precision ICs to prevent solder bridging.

2. Core Points of Printing Process

1. Squeegee & Pressure

   Select proper squeegee material and set appropriate pressure. Excessive pressure causes solder overflow and short circuit; insufficient pressure leads to missing solder.

2. Printing Speed

   Adjust speed according to solder paste and aperture size. Too fast speed results in incomplete filling, while too slow speed causes solder paste collapse.

3. Alignment Control

   Ensure accurate alignment between PCB pads and stencil apertures to avoid solder offset.

4. Environment Control

   Stable temperature and humidity are required in printing area. High humidity leads to solder beads, while dry environment makes solder paste dry up quickly.