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Causes and Improvement Solutions of SMT Dry Joints
A dry joint is a common hidden defect in SMT production. It refers to the condition that no effective solder covers the pad, and the component pin fails to form a firm connection with the PCB substrate.
Dry joints are hard to detect visually and easily cause intermittent connection failure in later application, which seriously affects the service life and stability of electronic products.

Main Causes

  1. PCB pads are dirty, oxidized and difficult to be wetted by solder;

  2. Component leads are warped or lifted, unable to fit closely with pads;

  3. Poor solderability of components caused by moisture and oxidation;

  4. Placement deviation leads to misalignment between pins and pads;

  5. Improper dispensing operation causes glue overflow and pad contamination;

  6. Missing or incomplete solder paste printing results in insufficient solder volume.

Improvement Measures

  1. Strict incoming inspection for PCB, reject oxidized and dirty boards;

  2. Inspect components strictly and eliminate warped or oxidized parts;

  3. Adopt moisture-proof storage and vacuum packaging for components;

  4. Calibrate placement machine regularly to reduce mounting offset;

  5. Standardize dispensing path and glue quantity to avoid pad contamination;

  6. Maintain stencil aperture integrity and repair blocked or deformed holes in time;

  7. Optimize printing parameters and reflow temperature to ensure sufficient solder wetting.

Dry joint prevention requires full-process control of PCB, components, printing, placement, dispensing and reflow. Combined with AOI inspection and first article confirmation, it can effectively reduce defect rate and avoid batch quality problems.
Globalwell implements strict full-process quality control in SMT production With strict material inspection, process debugging and production patrol inspection, we effectively prevent dry joints and other hidden soldering defects, delivering stable and reliable PCBA processing services.


 

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