Main Factors Affecting FPY
Material quality: Oxidation, deformation and poor solderability of PCB and components.
Printing process: Excessive, insufficient or offset solder paste causes short circuits and dry joints.
Mounting accuracy: Defects such as tombstoning, billboarding and component flipping.
Reflow soldering: Improper temperature profile leads to cold joints, dull joints and cracks.
On-site management: Lack of regular equipment maintenance and standardized operation.
Effective Solutions to Improve FPY
Carry out strict incoming inspection for PCB, components, solder paste and flux. Reject unqualified materials.
Fix printing parameters, inspect and maintain stencils and squeegees regularly.
Calibrate nozzles, vision system and mounting coordinates to reduce placement defects.
Customize reflow profile for different PCBs and components, and record temperature test data for each batch.
Implement first article inspection and in-line patrol to prevent batch defects.
Provide regular training for operators and standardize equipment maintenance rules.
Article keywords :PCB, PCB assembly, Printed circuit board,prototype pcb, pcb manufacturer, PCB factory, PCB board, PCB prototypes,pcb price, pcb fabricate, turn-key PCB
2026-05-26 09:39:34 

