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GLOBAL WELL Optimized BGA/QFN Soldering: Elevating High-Density PCB Reliability
Shenzhen Globalwei Technology Co., Ltd. is a national high-tech enterprise specialized in SMT mounting and PCBA processing. Founded in 2014 and headquartered in Bao’an, Shenzhen, the company owns an 8,000 ㎡ standardized factory and 7 fully automatic SMT production lines. It has obtained three major quality system certifications: ISO9001, ISO13485 and IATF16949. We long-term provide one-stop processing services ranging from prototype sampling to mass production for customers in medical treatment, automotive, industrial control, new energy and other industries.

With the continuous improvement of functional integration of electronic products, high-density packaged components such as BGA (Ball Grid Array) and QFN (Quad Flat No-leads) are widely adopted. Their soldering quality directly determines the electrical performance and service life of finished products. Drawing on years of rich processing experience, Globalwei has optimized detailed processes targeting the core difficulties in BGA/QFN soldering, greatly improving the manufacturing reliability of high-density circuit boards.


The major soldering pain points of BGA/QFN components focus on void control, bottom heat dissipation and pad wettability. Globalwei’s technical team has achieved targeted breakthroughs through refined process upgrades.


To solve solder voids, vacuum reflow soldering is adopted to keep the cavity pressure below 50mbar during soldering. Combined with optimized Sn-Ag-Cu-Ni solder paste formula, the solder void rate is controlled within 3%, far lower than the industry average of 8%.

To meet the bottom heat dissipation demand of QFN packages, customized high-thermal-conductivity pad solutions are adopted. By adding thermal vias and increasing copper coverage area, heat conduction efficiency is improved to prevent performance degradation under high-temperature operation.


In addition, the pad ball mounting process is upgraded with laser ball placement technology to ensure ball diameter consistency (deviation ≤ 0.02mm). Nitrogen atmosphere soldering is applied to enhance solder wettability and reduce defects such as bridging and cold joints.


To guarantee consistent process stability, Globalwei has established an exclusive process library for BGA/QFN packaging. For components with different pin pitches (minimum 0.2mm) and package sizes, corresponding parameters including temperature curves and solder paste dosage are preset. Cooperated with 100% X-Ray defect detection for solder joints, the connection reliability of every welding point is fully guaranteed. At present, this optimized process has been widely applied to high-density circuit board production including industrial control mainboards, new energy controllers and vehicle electronic modules.


For customers, mature BGA/QFN soldering technology delivers stronger stability of core components, which is especially suitable for high-end electronic equipment with strict reliability requirements. Globalwei will keep focusing on the technical upgrading of high-density packaging processing. Through practical process iteration, we continue to deliver customized SMT & PCBA processing services that perfectly meet customers’ actual production demands.



 

Article keywords ：PCB, PCB assembly, Printed circuit board，prototype pcb, pcb manufacturer, PCB factory, PCB board, PCB prototypes,pcb price, pcb fabricate, turn-key PCB

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