I. Compliance Assurance: Full Compliance with International Environmental Standards

1. Material Compliance

   All production lines adopt SAC305 lead-free solder paste (Sn-Ag-Cu) with lead content less than 1000ppm, eliminating heavy metal pollution and complying with directives including RoHS 2.0, REACH and China Voluntary RoHS.
2. System Certification

   We have obtained ISO9001, ISO13485 (Medical) and IATF16949 (Automotive) certifications. Equipped with Class 10000 dust-free and anti-static workshops, the whole production process is fully traceable.
3. Process Isolation

   Dedicated lead-free production lines are adopted with physical isolation of tools and fixtures, as well as professional staff training to avoid cross-contamination.

II. Core Craftsmanship: Reliability Control of Lead-Free Soldering

1. Solder & Alloy Material

   SAC305 alloy (Sn96.5/Ag3/Cu0.5) is applied, with a melting point of 217℃, solder joint strength ≥ 45MPa, and better thermal fatigue resistance and creep resistance than ordinary lead-free alloys.
2. Precision Temperature-Controlled Reflow Soldering

   12-zone nitrogen reflow soldering equipment is used with a peak temperature of 240–260℃. Optimized preheating, constant temperature, reflow and cooling curves reduce thermal shock and voids, compatible with fine-pitch packages such as 0201, QFN and BGA.
3. Stencil Printing & Mounting Optimization

• Stencil apertures are designed at a 0.9:1 ratio for fine-pitch components to reduce bridging risks;

• Fully automatic printing combined with SPI 3D solder paste inspection controls solder paste dosage deviation within ±5%;

• High-speed placement machines (Samsung SM471p/481p) deliver mounting accuracy of ±25μm with a minimum pitch of 0.2mm.

4. Solder Joint Strengthening Technology

   Pre-soldering treatment for gold-plated pins controls the gold content in solder below 1wt% to prevent gold brittleness failure. Nitrogen-protected soldering is implemented for key solder joints to reduce oxidation and improve wettability.

III. Full-Process Testing: Layer-by-Layer Reliability Verification

1. In-line Inspection

   AOI optical inspection (appearance, polarity & offset), X-Ray detection (BGA bottom voids & cold solder joints), ICT/FCT testing (circuit continuity and functional performance).
2. Reliability Test Items

• Thermal Cycling: -40℃～125℃, no cracking after more than 2000 cycles;

• Humidity & Aging Test: 85℃/85% RH, no corrosion after 1000 hours;

• Mechanical Vibration & Drop Test: Simulate harsh working conditions with no solder joint falling off.

IV. Production Capacity & Delivery: Stable Support for Mass and High-Precision Orders

• Production Line Configuration: 7 fully automatic SMT lines with a daily capacity of 12 million components, supporting 0201 (01005) ultra-precision components and full-range packages.

• Application Fields: Medical electronics, automotive electronics, industrial control, communication, AI and smart home products, serving global markets including the EU and North America.

V. Core Advantages

• Worry-free Compliance: Fully compliant with RoHS/REACH to avoid export risks;

• Superior Solder Joint Reliability: Lead-free solder joints feature higher strength and longer service life than leaded processes, suitable for harsh environments;

• Green Manufacturing: Non-toxic and eco-friendly, meeting ESG and sustainable development requirements;

• Cost-Effectiveness: Large-scale lead-free production lines balance high quality and reasonable cost.

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